MODEL GALLERY
Bond Wires to a Chip
Bonding wires connect an integrated circuit to the pins of the package that holds it. These wires introduce relatively large inductances that can introduce crosstalk and distort the signals.This model calculates the lumped parameters in the form of self inductance and the mutual inductance between several bonding wires. The result is an inductance matrix that reports how much neighboring wires influence each other.
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Bonding wires that connect an integrated circuit to the pins of the package that holds it introduce relatively large inductances that can introduce crosstalk and distort the signals. This model calculates the lumped parameters in the form of self inductance and the mutual inductance between several bonding wires. |
Engineering Fields
- AC & Quasi-Static Applications
Application Areas
- AC/DC Systems