Convection Cooling of Memory Array Modules

In this example, we show the effects of poor design in an array of four memory chips cooled by a perpendicular cooling stream. Fluid flow is coupled to heat transfer in model. In this case, each memory module (or chip) forms an obstacle for the cooling of the ones positioned downstream in the flow.

A large CFD and cooling model simulates the heat transfer from an electronic assembly. Here the direction of the flow is highly unsuited to adequately cool the chips.